Through Silicon Vias: Materials, Models, Design, and Performance - Brajesh Kumar Kaushik - Books - Taylor & Francis Ltd - 9780367574543 - June 30, 2020
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Brajesh Kumar Kaushik

Through Silicon Vias: Materials, Models, Design, and Performance 1st edition

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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

216 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 30, 2020
ISBN13 9780367574543
Publishers Taylor & Francis Ltd
Pages 216
Dimensions 150 × 220 × 10 mm   ·   453 g
Language English  
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