Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) - Asme - Books - American Society of Mechanical Engineers - 9780791885505 - May 30, 2022
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Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)

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Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

648 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released May 30, 2022
ISBN13 9780791885505
Publishers American Society of Mechanical Engineers
Pages 648
Dimensions 278 × 347 × 41 mm   ·   1.21 kg
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