Electromigration in Metals: Fundamentals to Nano-Interconnects - Ho, Paul S. (University of Texas, Austin) - Books - Cambridge University Press - 9781107032385 - May 12, 2022
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Electromigration in Metals: Fundamentals to Nano-Interconnects

Ho, Paul S. (University of Texas, Austin)

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Electromigration in Metals: Fundamentals to Nano-Interconnects

Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.

400 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 12, 2022
ISBN13 9781107032385
Publishers Cambridge University Press
Pages 430
Dimensions 251 × 176 × 27 mm   ·   978 g

See all of Ho, Paul S. (University of Texas, Austin) ( e.g. Hardcover Book )