Area Array Interconnection Handbook - - Books - Springer-Verlag New York Inc. - 9781461355298 - November 12, 2012
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Area Array Interconnection Handbook Softcover reprint of the original 1st ed. 2001 edition

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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer.

1900 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 12, 2012
ISBN13 9781461355298
Publishers Springer-Verlag New York Inc.
Pages 1188
Dimensions 178 × 254 × 36 mm   ·   2.46 kg
Language English  
Editor Puttlitz, Karl J.
Editor Totta, Paul A.

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