Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing - Seonho Seok - Books - Springer Nature Switzerland AG - 9783030085612 - January 5, 2019
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Softcover Reprint of the Original 1st 2018 edition

Seonho Seok

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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Softcover Reprint of the Original 1st 2018 edition

Media Books     Paperback Book   (Book with soft cover and glued back)
Released January 5, 2019
ISBN13 9783030085612
Publishers Springer Nature Switzerland AG
Pages 115
Dimensions 185 g
Language German  

See all of Seonho Seok ( e.g. Paperback Book and Hardcover Book )