Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics - Jan A. Dziuban - Books - Springer - 9789048171514 - November 25, 2010
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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Softcover reprint of hardcover 1st ed. 2006 edition

Jan A. Dziuban

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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Softcover reprint of hardcover 1st ed. 2006 edition

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

334 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 25, 2010
ISBN13 9789048171514
Publishers Springer
Pages 334
Dimensions 155 × 235 × 18 mm   ·   494 g
Language English  

See all of Jan A. Dziuban ( e.g. Hardcover Book and Paperback Book )