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Through-Silicon Vias for 3D Integration Ed edition
John Lau
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Through-Silicon Vias for 3D Integration Ed edition
John Lau
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.
512 pages, ill
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 16, 2012 |
| ISBN13 | 9780071785143 |
| Publishers | McGraw-Hill Education - Europe |
| Pages | 512 |
| Dimensions | 160 × 231 × 21 mm · 722 g |
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