Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China) - Books - John Wiley & Sons Inc - 9780470827802 - October 21, 2011
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China)

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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

576 pages, illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 21, 2011
ISBN13 9780470827802
Publishers John Wiley & Sons Inc
Pages 576
Dimensions 175 × 252 × 36 mm   ·   1.13 kg
Language English  
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