SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs - Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) - Books - John Wiley & Sons Inc - 9780471574811 - December 7, 1998
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SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs

Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China)

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SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

320 pages, illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 7, 1998
ISBN13 9780471574811
Publishers John Wiley & Sons Inc
Pages 320
Dimensions 164 × 246 × 20 mm   ·   566 g
Language English  

See all of Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) ( e.g. Hardcover Book )