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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press
B Keser
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press
B Keser
576 pages
Media | Books Hardcover Book (Book with hard spine and cover) |
Released | March 29, 2019 |
ISBN13 | 9781119314134 |
Publishers | John Wiley & Sons Inc |
Pages | 576 |
Dimensions | 235 × 160 × 33 mm · 1.03 kg |
Language | English |
Editor | Keser, Beth |
Editor | Krohnert, Steffen |