Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics - Jan A. Dziuban - Books - Springer-Verlag New York Inc. - 9781402045783 - June 13, 2006
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Jan A. Dziuban
Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics

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This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

334 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 13, 2006
ISBN13 9781402045783
Publishers Springer-Verlag New York Inc.
Pages 334
Dimensions 156 × 235 × 20 mm   ·   771 g
Language English  

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