Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science - Erdogan Madenci - Books - Kluwer Academic Publishers - 9781402073304 - December 31, 2002
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition

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Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.


205 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 31, 2002
ISBN13 9781402073304
Publishers Kluwer Academic Publishers
Pages 205
Dimensions 156 × 234 × 12 mm   ·   489 g
Language English  

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