Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects - Dean L. Monthei - Books - Springer-Verlag New York Inc. - 9781461373254 - March 14, 2014
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition

Dean L. Monthei

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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

248 pages, 62 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 14, 2014
ISBN13 9781461373254
Publishers Springer-Verlag New York Inc.
Pages 234
Dimensions 155 × 235 × 13 mm   ·   358 g
Language English  

See all of Dean L. Monthei ( e.g. Hardcover Book and Paperback Book )