Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development - Way Kuo - Books - Springer-Verlag New York Inc. - 9781461375968 - March 14, 2014
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Softcover Reprint of the Original 1st Ed. 1998 edition

Way Kuo

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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Softcover Reprint of the Original 1st Ed. 1998 edition

420 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 14, 2014
ISBN13 9781461375968
Publishers Springer-Verlag New York Inc.
Pages 420
Dimensions 155 × 235 × 22 mm   ·   589 g
Language English  
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