Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability - Tae-Kyu Lee - Books - Springer-Verlag New York Inc. - 9781461492658 - November 6, 2014
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Tae-Kyu Lee
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability 2015 edition

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.

253 pages, 69 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp

Media Books     Hardcover Book   (Book with hard spine and cover)
Released November 6, 2014
ISBN13 9781461492658
Publishers Springer-Verlag New York Inc.
Pages 253
Dimensions 163 × 241 × 16 mm   ·   553 g
Language English  

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