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ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
ASM International
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
461 pages
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | July 30, 2022 |
ISBN13 | 9781627084192 |
Publishers | A S M International |
Pages | 461 |
Dimensions | 286 × 231 × 31 mm · 1.15 kg |
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