Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - Ehrenfried Zschech - Books - Springer London Ltd - 9781849969673 - October 22, 2010
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition

Ehrenfried Zschech

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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

508 pages, 72 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 22, 2010
ISBN13 9781849969673
Publishers Springer London Ltd
Pages 508
Dimensions 155 × 235 × 27 mm   ·   734 g
Language English  
Editor Mikolajick, Thomas
Editor Whelan, Caroline
Editor Zschech, Ehrenfried
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