High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering - Chulwoo Kim - Books - Springer International Publishing AG - 9783319023809 - November 18, 2013
In case cover and title do not match, the title is correct

Chulwoo Kim
High-bandwidth Memory Interface - Springerbriefs in Electrical and Computer Engineering 2014 edition

Price
$ 73.49
excl. VAT

Ordered from remote warehouse

Expected delivery Jul 27 - Aug 6
Get notified about new Chulwoo Kim releases

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

112 pages, 50 black & white illustrations, 41 colour illustrations, 8 black & white tables, 1 colour

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 18, 2013
ISBN13 9783319023809
Publishers Springer International Publishing AG
Pages 112
Dimensions 155 × 235 × 5 mm   ·   149 g
Language English  

More from the same publisher

See all of Chulwoo Kim ( e.g. Paperback Book )