Materials for Advanced Packaging - C.P. Wong-Daniel Lu - Books - Springer International Publishing AG - 9783319832098 - June 8, 2018
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C.P. Wong-Daniel Lu
Materials for Advanced Packaging Softcover reprint of the original 2nd ed. 2017 edition

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Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.

969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 8, 2018
ISBN13 9783319832098
Publishers Springer International Publishing AG
Pages 969
Dimensions 234 × 157 × 55 mm   ·   1.49 kg
Language German  
Editor Lu, Daniel
Editor Wong, C.P.

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