Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie S. Hwang - Books - Springer - 9789401160520 - February 20, 2012
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Jennie S. Hwang
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly Softcover reprint of the original 1st ed. 1989 edition

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology.

456 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 20, 2012
ISBN13 9789401160520
Publishers Springer
Pages 456
Dimensions 152 × 229 × 25 mm   ·   639 g
Language English  

See all of Jennie S. Hwang ( e.g. Paperback Book )