Silver Metallization: Stability and Reliability - Engineering Materials and Processes - Daniel Adams - Books - Springer London Ltd - 9781848000261 - October 19, 2007
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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition

Daniel Adams

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Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits.

123 pages, 1, black & white illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 19, 2007
ISBN13 9781848000261
Publishers Springer London Ltd
Pages 123
Dimensions 155 × 235 × 9 mm   ·   317 g
Language English  
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