Silver Metallization: Stability and Reliability - Engineering Materials and Processes - Daniel Adams - Books - Springer London Ltd - 9781849967051 - March 14, 2012
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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition

Daniel Adams

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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition

Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits.

123 pages, black & white illustrations

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 14, 2012
Original release date 2011
ISBN13 9781849967051
Publishers Springer London Ltd
Pages 123
Dimensions 155 × 235 × 7 mm   ·   199 g
Language English  
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